• Low inductance
  • Controlled partial discharge
  • High current and voltage capabilities
  • Compact and flexible
  • Fully customized
  • Possibility of component integration ( e.g. Capacitors )
  • Wide range of products tailored to specific power density and inductance


ROLINX® CapLink Solutions

  • Unique soldering process mounts capacitors to ROLINX laminated busbars
  • Produces small, lightweight assemblies with extremely low inductance and high power density
  • Supports SiC technology

ROLINX® Compact

  • Most optimal connection solution for high power distribution in very limited space
  • Uses powder coating as outer insulation instead of insulation films, allowing for even greater compactness than a laminated busbar
  • Easy and quick to install
  • High power density capabilities and high temperature resistance


  • Most cost-efficient, simplified busbar solution
  • Designed to replace stacked busbars and simplify the supply chain


  • Flexible busbar with pure copper laminates
  • Offers flexibility for customized solutions
  • Space saving, easy and quick bending
  • Available in standard and customized length

ROLINX® Housing Solutions

  • Combines injection molding solutions with ROLINX busbar
  • Offers great flexibility for customized solutions
  • Features integration of connectors or structural functions

ROLINX® Hybrid

  • Combination of power and signal (logic) electronics on a single circuit
  • One-piece busbar solution reduces installation time and eliminates wiring errors
  • Simplifies the supply chain with a single-piece solution
  • Features integrated connectors and surface mount components

ROLINX® Performance

  • State-of-the-art laminated busbar technology for demanding, high power applications
  • Provides optimized inductance and controls partial discharge
  • Shaped to fit high voltage applications
  • Compact design

ROLINX® PowerCircuit Solution

  • Combines the advantages of PCB and laminated busbar
  • Meets the needs of low power applications with currents greater than 100 Amps
  • Fit for high volume assembly processes and interconnection techniques
  • Compact 3D design & wave soldering capability

ROLINX® Thermal

  • Enables existing power system design to be upgraded to a higher power level
  • Extended temperature 130 deg. C range and humidity rating
  • Allows for more power through the same copper section


Description Language File Type File Size
ROLINX Busbars General Overview English
ROLINX叠层母线排解决方案概览 中文
ROLINX e-Mobility Solutions Brochure English
ROLINX产品汽车应用手册 中文


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This monthly blog is contributed to by Olivier Mathieu and other experts from Rogers' Power Electronics Solutions, providing technical advice and information about advanced materials technologies that increase efficiency, manage heat and ensure quality and reliability.

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